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CVD of pure copper films from amidinate precursor
L. Aloui, V. Krisuyk, B. Sarapata, N. Prud’homme, F. Senocq, D. Samélor, C. Vahlas


Publication year:

2009

Kind of Publication:

Conference proceedings

Publication number:

261280

Project:

Advanced coating technologies (VIL E)


Further publications to this VIL/project

CMA VIL/VIU:

CMA VIL E

Supply source:

ECS Transaction, 2009, 25(8), 581-586.

Language:

English
Abstract
This paper reports on the use of a novel copper(I) amidinate compound [Cu(i-Pr-MeAMD)]2 to produce copper films in conventional low pressure CVD using hydrogen as reducing gas-reagent. Copper films were deposited on steel, silicon and SiO2/Si substrates. Their composition, morphology, conductivity and growth rate were investigated in the ... more